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Polycarbonate Raw Material PC Resin LUPOY SF1009IM With High Flow, High Impact For Mobile Phone Battery Cover For IMD

Polycarbonate Raw Material PC Resin LUPOY SF1009IM With High Flow, High Impact For Mobile Phone Battery Cover For IMD

  • Polycarbonate Raw Material PC Resin LUPOY SF1009IM With High Flow, High Impact For Mobile Phone Battery Cover For IMD
  • Polycarbonate Raw Material PC Resin LUPOY SF1009IM With High Flow, High Impact For Mobile Phone Battery Cover For IMD
  • Polycarbonate Raw Material PC Resin LUPOY SF1009IM With High Flow, High Impact For Mobile Phone Battery Cover For IMD
  • Polycarbonate Raw Material PC Resin LUPOY SF1009IM With High Flow, High Impact For Mobile Phone Battery Cover For IMD
  • Polycarbonate Raw Material PC Resin LUPOY SF1009IM With High Flow, High Impact For Mobile Phone Battery Cover For IMD
  • Polycarbonate Raw Material PC Resin LUPOY SF1009IM With High Flow, High Impact For Mobile Phone Battery Cover For IMD
  • Polycarbonate Raw Material PC Resin LUPOY SF1009IM With High Flow, High Impact For Mobile Phone Battery Cover For IMD
Polycarbonate Raw Material PC Resin LUPOY SF1009IM With High Flow, High Impact For Mobile Phone Battery Cover For IMD
Product Details:
Place of Origin: Korea
Brand Name: LG CHEM
Certification: MSDS, ROHS,REACH
Model Number: SF1009IM
Payment & Shipping Terms:
Minimum Order Quantity: 18T
Price: NEGOTIABLE ACCORDING TO ORDER QUANTITY
Packaging Details: 25KG/BAG, 40BAGS PER PALLET
Delivery Time: 30 WOKING DAYS UPON RECEIPT OF ORDER CONFIRMATION AND PAYMENT
Payment Terms: T/T
Supply Ability: 500T PER MONTH
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Detailed Product Description
Material: Polycarbonate Resin For IMD Description: High Flow, High Impact
Application: Mobile Phone Battery Cover For IMD Color: Customization
Grade: Injection Molding Grade Appearance: Granules
High Light:

pc plastic raw material

,

polycarbonate granules

PC LUPOY SF1009IM Injection Molding Grade Engineering Plastic with General Purpose, High Flow, High Impact for Mobile Phone Battery cover for IMD.
 
SF1009IM Quick Detail:
1. Injection Molding
2. General Purpose
3. High Flow
4. High Impact
 
SF1009IM Description:
1. Injection Molding PC Grade
2. General Purpose
3. High Flow : The melt flow rate is 22 based on ASTM
4.High Impact

 
SF1009IM Applications:
Mobile Phone Battery cover for IMD.
 
SF1009IM Datasheet:

Properties Test Condition Test Method Unit Typical Value
Physical        
Specific Gravity   ASTM D792 - 1.19
Molding Shrinkage (Flow), 3.2mm   ASTM D955 % 0.4 ~ 0.7
Melt Flow Rate 300℃/1.2kg ASTM D1238 g/10min 22
Mechanical        
Tensile Strength, 3.2mm   ASTM D638    
@ Yield 50mm/min   kg/cm2 570
Tensile Elongation, 3.2mm   ASTM D638    
@ Yield 50mm/min   % 100
Flexural Strength, 3.2mm 10mm/min ASTM D790 kg/cm2 900
Flexural Modulus, 3.2mm 10mm/min ASTM D790 kg/cm2 23,000
IZOD Impact Strength, 3.2mm   ASTM D256    
(Notched) 23℃   kg·cm/cm 80
  -30℃   kg·cm/cm  
Rockwell Hardness R-Scale ASTM D785 -  
Thermal        
Heat Deflection Temperature, 6.4mm   ASTM D648    
(Unannealed) 18.6kg   100
  4.6kg    
Vicat Softening Temperature   ASTM D1525    
  5kg, 50℃/h    
Flammability   UL94    
0.8mm     class HB
1.6mm     class  
2.5mm     class  
3.0mm     class  
Relative Temperature Index   UL 746B    
Electrical     80
Mechanical with Impact     80
Mechanical without Impact     80

 

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